0.12mm AMAOE CPU BGA Reballing Stencil Platform for A15 CPU iPhone 13/13 Mini/13 Pro/13 Pro Max repair. Amaoe A15 CPU BGA reballing stencil with positioning plate and metal base for iPhone 13 series CPU soldering repair. Amaoe A15 CPU BGA Reballing Stencil iPhone 13 mini/13/13 Pro/13 Pro Max CPU upper lower layer tin planting steel mesh positioning plate  magnet Base set.

Options:
- 0.12mm A15 lower stencil(half covered version).
- 0.12mm A15 lower stencil(uncovered version).
- 0.12mm A15 upper stencil.
- A15 Positioning plate.
- Universal base.
- A15 Full Set: 1x base, 1x positioning plate, 1x 0.12mm A15 lower stencil(half covered version)